2013-2028 Report on Global IC Packaging Market by Player, Region, Type, Application and Sales Channel


Report ID : RC-52487 Category : Semiconductor And Electronics
Published Date : Nov-19 Pages : 105 Format : PDF
The global IC Packaging market was valued at $XX million in 2018, and MAResearch analysts predict the global market size will reach $XX million by the end of 2028, growing at a CAGR of XX% between 2018 and 2028.

This report provides detailed historical analysis of global market for IC Packaging from 2013-2018, and provides extensive market forecasts from 2019-2028 by region/country and subsectors. It covers the sales volume, price, revenue, gross margin, historical growth and future perspectives in the IC Packaging market.

Leading players of IC Packaging including:
    ASE
    Amkor
    SPIL
    STATS ChipPac
    Powertech Technology
    J-devices
    UTAC
    JECT
    ChipMOS
    Chipbond

Market split by Type, can be divided into:
    DIP
    SOP
    QFP
    QFN
    BGA
    CSP

Market split by Application, can be divided into:
    CIS
    MEMS
    Others

Market split by Sales Channel, can be divided into:
    Direct Channel
    Distribution Channel

Market segment by Region/Country including:
    North America (United States, Canada and Mexico)
    Europe (Germany, UK, France, Italy, Russia and Spain etc.)
    Asia-Pacific (China, Japan, Korea, India, Australia and Southeast Asia etc.)
    South America Brazil, Argentina, Colombia and Chile etc.)
    Middle East & Africa (South Africa, Egypt, Nigeria and Saudi Arabia etc.)

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Table of Contents

Chapter 1 IC Packaging Market Overview
    1.1 IC Packaging Definition
    1.2 Global IC Packaging Market Size Status and Outlook (2013-2028)
    1.3 Global IC Packaging Market Size Comparison by Region (2013-2028)
    1.4 Global IC Packaging Market Size Comparison by Type (2013-2028)
    1.5 Global IC Packaging Market Size Comparison by Application (2013-2028)
    1.6 Global IC Packaging Market Size Comparison by Sales Channel (2013-2028)
    1.7 IC Packaging Market Dynamics
        1.7.1 Market Drivers/Opportunities
        1.7.2 Market Challenges/Risks
        1.7.3 Market News (Mergers/Acquisitions/ Expansion)
Chapter 2 IC Packaging Market Segment Analysis by Player
    2.1 Global IC Packaging Sales and Market Share by Player (2016-2018)
    2.2 Global IC Packaging Revenue and Market Share by Player (2016-2018)
    2.3 Global IC Packaging Average Price by Player (2016-2018)
    2.4 Players Competition Situation & Trends
    2.5 Conclusion of Segment by Player
Chapter 3 IC Packaging Market Segment Analysis by Type
    3.1 Global IC Packaging Market by Type
        3.1.1 DIP
        3.1.2 SOP
        3.1.3 QFP
        3.1.4 QFN
        3.1.5 BGA
    3.2 Global IC Packaging Sales and Market Share by Type (2013-2018)
    3.3 Global IC Packaging Revenue and Market Share by Type (2013-2018)
    3.4 Global IC Packaging Average Price by Type (2013-2018)
    3.5 Leading Players of IC Packaging by Type in 2018
    3.6 Conclusion of Segment by Type
Chapter 4 IC Packaging Market Segment Analysis by Application
    4.1 Global IC Packaging Market by Application
        4.1.1 CIS
        4.1.2 MEMS
        4.1.3 Others
    4.2 Global IC Packaging Sales and Market Share by Application (2013-2018)
    4.3 Leading Consumers of IC Packaging by Application in 2018
    4.4 Conclusion of Segment by Application
Chapter 5 IC Packaging Market Segment Analysis by Sales Channel
    5.1 Global IC Packaging Market by Sales Channel
        5.1.1 Direct Channel
        5.1.2 Distribution Channel
    5.2 Global IC Packaging Sales and Market Share by Sales Channel (2013-2018)
    5.3 Leading Distributors/Dealers of IC Packaging by Sales Channel in 2018
    5.4 Conclusion of Segment by Sales Channel
Chapter 6 IC Packaging Market Segment Analysis by Region
    6.1 Global IC Packaging Market Size and CAGR by Region (2013-2028)
    6.2 Global IC Packaging Sales and Market Share by Region (2013-2018)
    6.3 Global IC Packaging Revenue and Market Share by Region (2013-2018)
    6.4 North America
        6.4.1 North America Market by Country
        6.4.2 North America IC Packaging Market Share by Type
        6.4.3 North America IC Packaging Market Share by Application
        6.4.4 United States
        6.4.5 Canada
        6.4.6 Mexico
    6.5 Europe
        6.5.1 Europe Market by Country
        6.5.2 Europe IC Packaging Market Share by Type
        6.5.3 Europe IC Packaging Market Share by Application
        6.5.4 Germany
        6.5.5 UK
        6.5.6 France
        6.5.7 Italy
        6.5.8 Russia
        6.5.9 Spain
    6.6 Asia-Pacific
        6.6.1 Asia-Pacific Market by Country
        6.6.2 Asia-Pacific IC Packaging Market Share by Type
        6.6.3 Asia-Pacific IC Packaging Market Share by Application
        6.6.4 China
        6.6.5 Japan
        6.6.6 Korea
        6.6.7 India
        6.6.8 Southeast Asia
        6.6.9 Australia
    6.7 South America
        6.7.1 South America Market by Country
        6.7.2 South America IC Packaging Market Share by Type
        6.7.3 South America IC Packaging Market Share by Application
        6.7.4 Brazil
        6.7.5 Argentina
        6.7.6 Colombia
        6.7.7 Chile
    6.8 Middle East & Africa
        6.8.1 Middle East & Africa Market by Country
        6.8.2 Middle East & Africa IC Packaging Market Share by Type
        6.8.3 Middle East & Africa IC Packaging Market Share by Application
        6.8.4 Egypt
        6.8.5 Saudi Arabia
        6.8.6 South Africa
        6.8.7 Nigeria
    6.9 Conclusion of Segment by Region
Chapter 7 Profile of Leading IC Packaging Players
    7.1 ASE
        7.1.1 Company Snapshot
        7.1.2 Product/Business Offered
        7.1.3 Business Performance (Sales, Price, Revenue, Gross Margin and Market Share)
        7.1.4 Strategy and SWOT Analysis
    7.2 Amkor
    7.3 SPIL
    7.4 STATS ChipPac
    7.5 Powertech Technology
    7.6 J-devices
    7.7 UTAC
    7.8 JECT
    7.9 ChipMOS
    7.10 Chipbond
Chapter 8 Upstream and Downstream Analysis of IC Packaging
    8.1 Industrial Chain of IC Packaging
    8.2 Upstream of IC Packaging
        8.2.1 Raw Materials
        8.2.2 Labor Cost
        8.2.3 Manufacturing Expenses
        8.2.4 Manufacturing Cost Structure
        8.2.5 Manufacturing Process
    8.3 Downstream of IC Packaging
        8.3.1 Leading Distributors/Dealers of IC Packaging
        8.3.2 Leading Consumers of IC Packaging
Chapter 9 Development Trend of IC Packaging (2019-2028)
    9.1 Global IC Packaging Market Size (Sales and Revenue) Forecast (2019-2028)
    9.2 Global IC Packaging Market Size and CAGR Forecast by Region (2019-2028)
    9.3 Global IC Packaging Market Size and CAGR Forecast by Type (2019-2028)
    9.4 Global IC Packaging Market Size and CAGR Forecast by Application (2019-2028)
    9.5 Global IC Packaging Market Size Forecast by Sales Channel (2019-2028)
Chapter 10 Appendix
    10.1 Research Methodology
    10.2 Data Sources
    10.3 Disclaimer
    10.4 Analysts Certification

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