In-depth Research Report of Global IC-Substrate Market (2019 Version)

Report ID : RC-46327 Category : Semiconductor And Electronics
Published Date : Jul-19 Pages : 145 Format : PDF
The Report mainly includes sales, revenue, trade, competition, investment, forecast and marketing of the product and the segments here include companies, types, applications, regions, countries, etc. 

The Global  market of IC-Substrate is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new LDI (Lilan Data & Info) study.

The regions of IC-Substrate contain all Global  market, especially in North America, Europe, Asia Pacific, Latin America and MEA. 

Players include Ibiden(JP), Shinko Electric Industries(JP), Kyocera(JP), Eastern(JP), TTM Technologies(US), Unimicron(TW), Kinsus(TW), Nanya(TW), ASE(TW), Semco(KR), LG Innotek(KR), Simmtech(KR), Daeduck(KR), KCC(KR), Zhen Ding Technology(TW), AT&S (a Austrian company, has IC substrate factories in Chongqing, China), Shennan Circuit(CN), ACCESS(CN), Shenzhen Fastprint Circuit Tech(CN), etc.

Types cover FC-CSP, FC-BGA, CSP, BGA, etc. and applications cover PC (Tablet, Laptop), Smart Phone, Wearable Devices, Others, etc.

There are 11 Chapters to deeply display the global IC-Substrate market.
Chapter 1, is  definition and segment of IC-Substrate;
Chapter 2, is executive summary of IC-Substrate Market;
Chapter 3, to explain the industry chain of IC-Substrate;
Chapter 4, to show info and data comparison of  IC-Substrate Players;
Chapter 5, to show comparison of types;
Chapter 6, to show comparison of applications;
Chapter 7, to show comparison of regions and coutries(or sub-regions);
Chapter 8, to show competition and trade situation of IC-Substrate Market;
Chapter 9, to forecast IC-Substrate market in the next years;
Chapter 10, to show investment of IC-Substrate Market;
Table of Contents

Chap. 1, Definition and Segment
    1.1, Definition
    1.2, Segments
        A, Type Segment
        B, Application Segment
        C, Regional Segment

Chap. 2, Executive Summary of IC-Substrate Market

Chap. 3, Industrial Chain Analysis of IC-Substrate Market
    3.1, Industrial Chain of IC-Substrate
    3.2, Production Process of IC-Substrate
    3.3, Upstream and Cost of IC-Substrate
        A, Raw Materials Cost
        B, Equipment Market
        C, Labor Cost Analysis
        D, Cost Structure Analysis
    3.4, Distribution
        A, Marketing Channel
        B, Distributors/Agents
    3.5, Downstream

Chap. 4, Comparison of Companies
    4.1, Comprehensive Analysis of IC-Substrate Companies
        4.1.1, Business Comparison of Companies
        4.1.2, IC-Substrate Business Distribution by Companies
        4.1.3, IC-Substrate Product Comparison by Companies
    4.2, IC-Substrate Sales and Revenue by Companies
    4.3, Data Details (Sales, Revenue, Price, Share, Growth Rate, Gross Margin) Analysis of IC-Substrate by Companies
        Comp. 1: Data Details (Sales, Revenue, Price, Share, Growth Rate, Gross Margin) of Ibiden(JP)
        Comp. 2: Data Details of Shinko Electric Industries(JP)
        Comp. 3: Data Details of Kyocera(JP)
        Comp. 4: Data Details of Eastern(JP)
        Comp. 5: Data Details of TTM Technologies(US)
        Comp. 6: Data Details of Unimicron(TW)
        Comp. 7: Data Details of Kinsus(TW)
        Comp. 8: Data Details of Nanya(TW)
        Comp. 9: Data Details of ASE(TW)
        Comp. 10: Data Details of Semco(KR)
        Comp. 11: Data Details of LG Innotek(KR)
        Comp. 12: Data Details of Simmtech(KR)
        Comp. 13: Data Details of Daeduck(KR)
        Comp. 14: Data Details of KCC(KR)
        Comp. 15: Data Details of Zhen Ding Technology(TW)
        Comp. 16: Data Details of AT&S (a Austrian company, has IC substrate factories in Chongqing, China)
        Comp. 17: Data Details of Shennan Circuit(CN)
        Comp. 18: Data Details of ACCESS(CN)
        Comp. 19: Data Details of Shenzhen Fastprint Circuit Tech(CN)

Chap. 5, Comparison of Types (Sales, Revenue, Share, Price, Growth)
    5.1, FC-CSP
    5.2, FC-BGA
    5.3, CSP
    5.4, BGA

Chap. 6, Comparison of Applications (Sales, Share, Growth)
    6.1, PC (Tablet, Laptop)
    6.2, Smart Phone
    6.3, Wearable Devices
    6.4, Others

Chap. 7, Comparison of Regions (Sales, Price, Revenue, Share, Growth)
    7.1, North America
        7.1.1, Sub-regions of North America
        7.1.2, U.S.A.
        7.1.3, Canada
    7.2, Europe
        7.2.1 Sub-regions of Europe
        7.2.2, Germany
        7.2.3, U.K.
        7.2.4, France
        7.2.5, Italy
        7.2.6, Spain
    7.3, Asia Pacific
        7.3.1, Sub-regions of Asia Pacific
        7.3.2, China
        7.3.3, India
        7.3.4, Japan
        7.3.5, Oceania
        7.3.6, SEA
    7.4, Latin America
        7.4.1, Sub-regions of Latin America
        7.4.2, Brazil
        7.4.3, Mexico
    7.5, MEA
        7.5.1, Sub-regions of MEA
        7.5.2, Mid-east
        7.5.3, South Africa

Chap. 8, Competition and Trade Situation Analysis of IC-Substrate Market
    8.1, Competition Situation by Players
        8.1.1, Market Concentration by Players
        8.1.2, Mergers & Acquisitions, Expansions
        8.1.3, New Entrants
    8.2, Competition Situation by Regions
    8.3, Trade Situation by Regions
        8.3.1, Trade Data (Import and Export) of North America
        8.3.2, Trade Data of Europe
        8.3.3, Trade Data of Asia Pacific
        8.3.4, Trade Data of Latin America
        8.3.5, Trade Data of MEA

Chap. 9, Forecast of IC-Substrate Market
    9.1, Market Size Forecast
        9.1.1, Opportunity
        9.1.2, Restraints
        9.1.3, Market Trend (Sales, Revenue)
    9.2, Types Forecast (Sales, Revenue)
    9.3, Application Forecast (Sales)
    9.4, Regional Forecast (Sales, Revenue)

Chap. 10, Investment Analysis of IC-Substrate Market
    10.1, Investment Opportunity
    10.2, Investment Calculation
        10.2.1, Cost Calculation
        10.2.2, Revenue Calculation
        10.2.3, Economic Performance Evaluation

Chap. 11, Appendix (Free Info)
    11.1, Profiles and IC-Substrate Product Information of Key Companies
        Comp. 1: (Profiles and IC-Substrate Product Information of) Ibiden(JP)
        Comp. 2: Shinko Electric Industries(JP)
        Comp. 3: Kyocera(JP)
        Comp. 4: Eastern(JP)
        Comp. 5: TTM Technologies(US)
        Comp. 6: Unimicron(TW)
        Comp. 7: Kinsus(TW)
        Comp. 8: Nanya(TW)
        Comp. 9: ASE(TW)
        Comp. 10: Semco(KR)
        Comp. 11: LG Innotek(KR)
        Comp. 12: Simmtech(KR)
        Comp. 13: Daeduck(KR)
        Comp. 14: KCC(KR)
        Comp. 15: Zhen Ding Technology(TW)
        Comp. 16: AT&S (a Austrian company, has IC substrate factories in Chongqing, China)
        Comp. 17: Shennan Circuit(CN)
        Comp. 18: ACCESS(CN)
        Comp. 19: Shenzhen Fastprint Circuit Tech(CN)
    11.2, Contact Info of Related Companies
    11.3, Assumptions and Research Methodology
    11.4, Average Annual Exchange Rate
    11.5, Global and Regional Economic Change
    11.6, Global and Regional Labor Cost Index
    11.7, Relevant Policy (Examples)
    11.8, Relevant Patent and Technological Innovation (Examples)
    11.9, Info & Data Source
    11.10, Details of Abbreviated Words
    11.11, Disclaimer
    11.12, Author List

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